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  • 铜箔麦拉按性能分类

    本站编辑:杭州临安金盛泰箔带有限公司发布日期:2020-08-11 09:40 浏览次数:

    对CCL、PCB用铜箔按其性能分为:标准铜箔、高温高延伸性铜箔、高延伸性铜箔、耐转移铜箔、低轮廓铜箔等。

    Copper foil for CCL and PCB can be divided into standard copper foil, high temperature and high elongation copper foil, high elongation copper foil, transfer resistant copper foil and low profile copper foil.

    1.标准铜箔

    1. Standard copper foil

    主要用于压制纸基酚醛树脂覆铜箔层压板和环氧树脂玻纤布覆铜箔层压板,对于用于纸基覆铜板的铜箔,为了提高铜箔与基材的结合强度,在对铜箔进行粗化处理后,还要涂一层专用胶,这种铜箔的粗化面粗糙度比较大,铜箔的厚度一般在35-70um左右,各种性能要求不是很高。对于用于玻纤布覆铜板的铜箔,除了进行必要的粗化处理外,还要进行耐热处理(如镀锌、镀黄铜等),特殊耐高温防氧化处理,与基材有较高的结合力,耐热温度达到200℃左右,它以18um铜箔为主体。

    It is mainly used to press paper-based phenolic resin copper-clad laminate and epoxy resin glass fiber cloth copper-clad laminate. For the copper foil used in paper-based copper clad laminate, in order to improve the bonding strength between copper foil and substrate, a layer of special adhesive should be coated after the copper foil is roughened. The roughening surface roughness of the copper foil is relatively large, and the thickness of the copper foil is generally about 35-70um, and various performance requirements are required It's not very high. For the copper foil used in glass fiber cloth copper clad laminate, in addition to the necessary roughening treatment, but also heat-resistant treatment (such as zinc plating, brass plating, etc.), special high-temperature and anti-oxidation treatment, has a high binding force with the substrate, the heat-resistant temperature is about 200 ℃, it is mainly 18um copper foil.

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    2.高温高延伸性铜箔(THE铜箔)

    2. High temperature and high elongation copper foil (the copper foil)

    主要用于多层印制板上,由于多层印制板在压合时的热量会使铜箔发生再结晶现象,需要在高温(180℃)时也能有和常温时一样的高延伸率,就需要高温延伸性铜箔,以保证印制板制作过程中不出现裂环现象等。

    It is mainly used on multi-layer printed boards. Because the heat of multi-layer printed circuit board will cause the copper foil to recrystallize, it is necessary to have the same high elongation at high temperature (180 ℃) as that at normal temperature. Therefore, high-temperature extensible copper foil is needed to ensure that there is no ring crack during the production of printed circuit board.

    3.高延伸性铜箔(HD)

    3. High elongation copper foil (hd)

    主要用于挠性线路板上,要求具有很高的耐折性,因而要求它必须具有很高的致密度,并进行必要的热处理过程。

    It is mainly used in flexible circuit board, which requires high bending resistance, so it must have high density and necessary heat treatment process.

    4.耐转移铜箔

    4. Transfer resistant copper foil

    主要用于绝缘要求比较高的印制线路板上,如果铜箔被制成线路板后,发生铜离子转移,则对基板的绝缘可靠性会造成相当大的影响。因此必须对铜箔表面进行特殊的处理(如镀镍等),以抑制铜的进一步离子化及进一步转移。

    It is mainly used in printed circuit board with high insulation requirements. If copper ion transfer occurs after copper foil is made into circuit board, the insulation reliability of the substrate will be greatly affected. Therefore, special treatment (such as nickel plating) on the surface of copper foil is necessary to inhibit further ionization and further transfer of copper.